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N-pin package

См. также в других словарях:

  • Pin grid array — del Motorola XC68020. El pin grid array o PGA es un tipo de empaquetado usado para los circuitos integrados, particularmente microprocesadores. Originalmente el PGA, el zócalo clásico para la inserción en una placa base de un microprocesador, fue …   Wikipedia Español

  • Pin grid array — A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package. The pins are commonly spaced… …   Wikipedia

  • Pin (professional wrestling) — A pinfall, a pin, or a fall (the first term most commonly used in professional wrestling) is a victory condition in various forms of wrestling that is met by holding an opponent s shoulders on the wrestling mat for a prescribed period of time.In… …   Wikipedia

  • Package management system — A package management system is a collection of tools to automate the process of installing, upgrading, configuring, and removing software packages from a computer. Linux and other Unix like systems typically manage thousands of discrete… …   Wikipedia

  • pin grid array package — korpusas su matriciniais išvadais statusas T sritis radioelektronika atitikmenys: angl. pin grid array package vok. Gehäuse mit Anschlußstiftmatrix, n rus. корпус с матричным расположением выводов, m; матричный корпус, m pranc. boîtier fakir, m …   Radioelektronikos terminų žodynas

  • Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …   Wikipedia

  • Flip-chip pin grid array — (FC PGA or FCPGA) is a form of pin grid array processor architecture package in which the die faces downwards on the top of the CPU with the back of the die exposed. This allows the die to have a more direct contact with the heatsink or other… …   Wikipedia

  • Chip Scale Package — Ein Embedded Intel Pentium MMX in BGA Bauweise von unten gesehen. Gut zu erkennen sind die Lotperlen. Beidseitig bestückte Platine in BGA Technik …   Deutsch Wikipedia

  • Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

  • Staggered Pin Grid Array — A staggered pin grid array (SPGA) refers to a style of arranging pins on an integrated circuit package. It consists of two square arrays of pins, offset in both directions by half the minimum distance between pins in one of the arrays. Put… …   Wikipedia

  • Ceramic pin grid array — 133 MHz Pentium chip in a ceramic package You may be looking for Cornish Pilot Gig Association. CPGA stands for Ceramic Pin Grid Array, a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with… …   Wikipedia

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